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With the help of this expert guide, you can design and package the high-frequency circuitry crucial to the performance of todayÕs advanced electronic products, such as Pentium chips, HDTV, and mobile communications. This book fully explains approaches that include basic signal transmission theory, digital and microwave circuit design, and how these are integrated with the packaging and interconnection characteristics. YouÕll find detailed coverage of signal behavior in both high speed digital and microwave circuits, as well as crucial aspects of materials selection and manufacturing.
- Sales Rank: #2412147 in Books
- Published on: 1997-05-01
- Original language: English
- Number of items: 1
- Dimensions: 9.00" h x 1.28" w x 6.10" l, 1.76 pounds
- Binding: Hardcover
- 345 pages
From the Back Cover
A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.
About the Author
Stephen G. Konsowski has 34 years of electronic packaging engineering experience. Retired from Westinghouse as an an advisory engineer, he is now associated with Technology Seminars, Inc. of Lutherville, Maryland. He is a founding member of the Intenrational Electronics Packaging Society (IEPS) and one of its former directors. Mr. Konsowski has authored many technical papers and articles on electronic packaging, including a chapter for the Second Edition of McGraw-HillÕs Handbook of Electronic Materials and Processes and Handbook of Packaging and Interconnection. Arden R. Helland is an advisory engineer at the Northrop Grumman CorporationÕs Electronic Sensors and Systems Division with over 35 years of experience in all phases of electrical design for advanced electronic systems. He is the author of the chapter on the reliability digital systems for the McGraw-Hill Computer Engineering Handbook.
Most helpful customer reviews
0 of 0 people found the following review helpful.
Not very mathematical... not very useful...
By JASA
This book is broad on its coverage, but it treats the matters mostly at the qualitative level. So it is perhaps good for technicians and newcomers to the high speed/high frequency field but it misses the quantitative analysis and discussion needed to perform design of products and engineering. For instance, high frequency models of devices (e.g. at Spice level) accounting for packaging effects (e.g. wire bonding, etc...) are not discussed or even presented. As such I think that this was a wrong acquisition for me.
0 of 1 people found the following review helpful.
Great for understanding the field !
By Rich
Only made it to 2nd chapter so far, but very informative in the understanding of the field for someone just beginning the world of high speed packaging with concise explanations.
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